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Powders and components: Characterization and quality assurance certified according to ISO 9001:2015
Horizon Results Platform
Author:
Janne Haack
Last updated:
26.01.2026
Polymer-Based Silver Screen-Printing Paste for Ultra-Fine 50 µm Conductive Lines (AG 511 EI)
Prototypes and Products
Author:
Chimet S.p.A.
Last updated:
31.10.2025
FOIM: Thermal Foaming of Polyurethane Foil
Innovation Service
Author:
Thorsten Pretsch
Last updated:
11.09.2025
Silanchemie 3.0 – Modular Material Design with Tailored Siloxene Architectures
Innovation Service
Author:
Siloxene
Last updated:
02.06.2025
Company Realignment and Sales Innovation
Patents and KnowHow
Author:
Heiko Weit
Last updated:
18.03.2025
Job Coating: High-Performance Solutions for Complex Geometries
Innovation Service
Author:
Kunststoff-Institut Lüdenscheid
Last updated:
07.02.2025
Functionalized Ultra-Thin Flexible Glass
Innovation Service
Author:
Dr. Wiebke Langgemach
Last updated:
01.12.2025
Search Results
3rd Polish-German Call for Proposals for Joint Research and Development Projects
Project budget:
Polish side: up to PLN 2,000,000; German…
Deadline:
30.04.2026
4th German-Chilean Call for Proposals for Joint R&D Projects
Project budget:
CLP 220 million (~€215,000)
Deadline:
31.03.2026
37th IraSME Call for Proposals: Belgium, Wallonia
Project budget:
SMEs: 60 – 75%; Large companies: 40%; Re…
Deadline:
25.03.2026
37th IraSME Call for Proposals: Türkiye
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€325,000
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25.03.2026
37th IraSME Call for Proposals: Czech Republic
Project budget:
50 million CZK per consortium
Deadline:
25.03.2026
37th IraSME Call for Proposals: Luxembourg
Project budget:
Small companies: 60%; Medium-sized compa…
Deadline:
25.03.2026
37th IraSME Call for Proposals: Belgium, Flanders
Project budget:
EUR 500,000
Deadline:
25.03.2026
37th IraSME Call for Proposals: Brazil
Project budget:
1/3 of Brazilian project costs
Deadline:
25.03.2026
What does semiconductor wafer size have to do with critical technologies?
Publisher:
VTT
Published:
20.01.2026
Printed electronics reaching accuracy of one micrometre
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Published:
15.01.2026
Activated carbon from domestic biomass for micropollutant removal
Publisher:
VTT
Published:
12.12.2025
Breakthrough in D-band wireless: Anritsu and VTT demonstrate world-leading transmitarray-based high-speed connectivity
Publisher:
VTT
Published:
08.01.2026
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