Result description
The feasibility and reliability of “copper-based” and “lithography-free” technique was demonstrated:
a) the realization of DLD/DLM durable nozzle allowing to process fingers widths in the range of 50 micrometre. Suitable equipment to perform the correct measurement in order to identify nozzle position and move them with the necessary precision and accuracy in the XYZ directions: lithography-free” technique.
b) developed and to optimize a wide processing window for a fast-electrochemical process that allow to reach the aims of the project: “copper-based” technology. The main processing regimes are:
- Electrochemical reduction of the ITO transparent contact preserving the integrity of the amorphous silicon passivation layer.
- Electroplating of a Ni buffer layer (form nickel sulfamate baths). The Ni film improve the adhesion of the all contact to the substrate and prevents acids from attacking the reduced In-Sn nanostructures.
- Electrodeposition of a thick (e.g. 2090 µm) copper film by PRP (Pulse Reverse Plating) at high speed 1.3 micron/second.
Addressing target audiences and expressing needs
- Collaboration
- Business Angels
- Venture Capital
Business development partner as also Investor to gain international market
- Research and Technology Organisations
- Private Investors
R&D, Technology and Innovation aspects
All problem where solved for the realization of the necessary small nozzle dimension using a durable and chemical inert material. Metallization process of HJT solar cell is realized. Ongoing is the realization of the first industrial 100MW production line for mask-less copper deposition.
Result submitted to Horizon Results Platform by RISE TECHNOLOGY SRL
